800G/1.6T Thin Film LiNbO3 Modulator Chip(DR8)

ORI-MZM-T-BW is the thermal tuning version, whose phase shift is tuned by micron heaters integrated on chip. Compared to traditional LN modulators, the heater version could maintain a lot more stable bias point throughout lifetime of the device. The device is a hermetic sealing package with internal optical power, which save more space size for the end user.

800G/1.6T Thin Film LiNbO3 Modulator Chip(DR8)

Product Introduction:

800G/1.6T integrated chip based on thin-film lithium niobate. Driven single-ended by a DSP or EAM driver.

 

Integrate the following components:

1. Integrated 1x8 beam splitter (DR8)

2. Eight-way MZM modulator

3. Input and output optical power monitoring PD

4. Mode spot conversion SSC

5.On-chip 50 ohm matching resistor

 

Scope of Application:

8x100G, 8x200G Data Center Applications

 

Specification:

Chip Size(DR8)

5×11.5mm

Vpp requirements(ER>4dB)

1.2V

RF bandwidth

>67GHz

Single MZM insertion loss

<4.5dB

extinction ratio

>20dB

half-wave voltage

<2.8V(@100khz)

Keyword:

intensity modulator

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