800G/1.6T Thin-Film LiNbO3 Modulator Chip (DR8)

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800G/1.6T Thin-Film LiNbO3 Modulator Chip (DR8)

Product Introduction:

An 800G/1.6T integrated chip based on thin-film lithium niobate. It employs single-ended driving via either a DSP or an EAM driver.

 

Integrates the following components:

1. Integrated 1x8 beam splitter (DR8)

2. Eight-Channel MZM Modulator

3. Input and output optical power monitoring PD

4. Modulation-Spot Conversion SSC

5. On-chip 50-ohm matching resistor

 

Scope of application:

8x100G, 8x200G data center applications

 

Key Metrics:

Chip size (DR8)

5×11.5mm

Vpp requirement (ER > 4 dB)

1.2 V

RF bandwidth

> 67 GHz

Insertion loss of a single MZM

< 4.5 dB

Extinction ratio

> 20 dB

Half-wave voltage

< 2.8 V (@100 kHz)

 

Keywords:

Lidar seed source

Gas-sensing DFB laser

10G/25G high-speed directly modulated DFB laser chip

1342 nm, 1358 nm high-power DFB

10G 1270nm DFB

Single-channel folded LN modulator

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