Optical Communication Chip Packaging and Testing Engineer/Supervisor

Job Requirements:

◇ Candidates with a master’s degree or higher are preferred, holding degrees in physics, communications, microelectronics, optics, optoelectronics, mechanical engineering, electrical engineering, or other related STEM disciplines.

◇ Five or more years of experience in optical communication chip packaging and module manufacturing technology; candidates with strong technical development skills and a solid understanding of the market will be given priority.

◇ Possesses extensive packaging and testing experience across multiple technologies, including TO and butterfly packages, and is capable of conducting optical simulations independently; candidates with high-frequency packaging experience are preferred.

◇ Prior experience in testing optical communication chips, devices, and modules is preferred.

◇ Preference will be given to candidates who are skilled at organizing and managing teams.

Salary and Benefits:

◇ Stock option incentives, year-end bonuses, performance-based bonuses, and other contribution awards

◇ Bonuses and annual performance‑based promotions are allocated based on individual performance improvements and work attitude.

◇ Purchase social insurance in accordance with national regulations and enjoy statutory holidays as prescribed by law.

◇ Hearty lunches, afternoon tea, housing allowances, holiday gifts, and more

◇ A safe, environmentally friendly, and comfortable work and living environment

◇ A comprehensive system of occupational safety and health, knowledge and skills training, and career advancement